| 摘要 |
Spacers for use on a surface of a semiconductor device component may be fabricated from dielectric materials. For example, stereolithographic or other processes in which a plurality of layers are formed that are contiguous, at least partially superimposed relative to one another, and mutually adhered. These processes may include use of a machine vision system for recognition of the position and orientation of a semiconductor device component upon disposal or fabrication of one or more spacers thereon. One or more of the insulative spacers may be formed or disposed on the surface of a semiconductor device component prior to securing the semiconductor device component to a higher level component, such as a carrier substrate. The spacers may define a minimum, substantially uniform distance between the semiconductor device components. The spacers may also prevent tilting or tipping of one of the semiconductor device components relative to the other.
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