发明名称 SOLDER MATERIAL COATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solder material coating method capable of surely jointing a jointing part with the required quantity of jointing material. SOLUTION: The solder material coating method for soldering members 110, 120 together, in which correlation between the solder coating quantity M and the solder material coating position a to reach the jointing part 130 of the members 110, 120 is determined previously, based on which the solder material coating position a or the solder coating quantity M is decided to coat the solder material 140 after assembling the members 110, 120. The solder material coating position a is defined by the distance a from the jointing part 130, deciding the distance a to be made smaller than 1/2 of the spread dimension of the solder material 140 to be determined corresponding to the solder material coating quantity M. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003285160(A) 申请公布日期 2003.10.07
申请号 JP20020109280 申请日期 2002.04.11
申请人 DENSO CORP 发明人 NORO SHINYA;HATTORI TAKASHI;IZUHARA AKIHISA
分类号 B05D1/26;B05C13/00;B05D7/00;B23K1/00;B23K3/06;(IPC1-7):B23K3/06 主分类号 B05D1/26
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