JIG FOR POLISHING WAFER AND METHOD FOR MANUFACTURING THE SAME, AND APPARATUS FOR POLISHING WAFER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a ceramic jig for polishing wafers used in polishing a plate shape body, such as semiconductor wafers, which is able to improve flatness and parallelism of the wafers without being corroded even in alkaline chemicals and ultrasonic waves used in a cleaning process of the jig for polishing the wafer.

SOLUTION: A ceramic guide member is jointed to an outer periphery of a ceramic stick plate having a wafer sticking surface so as to give the projecting height corresponding to the final finishing thickness of the wafer.

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