| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad, a polishing apparatus provided with the polishing pad, and a method for manufacturing a semiconductor device using the polishing apparatus, which are used to form flat surfaces on glass, semiconductor, dielectric-substance/metal composite substance, integrated circuits, etc., and can polish a surface of a board so as to produce few scratches, and can optically and exactly measure polishing conditions during polishing. <P>SOLUTION: The polishing pad 4 is provided with a polishing layer 1, and one or more transparent window members 2 which are integrally formed in a part of the polishing layer to optically measure the polishing conditions. The polishing pad is characterized in that the transparent window members are made of a transparent resin composition having a phase-separated structure. <P>COPYRIGHT: (C)2004,JPO |
