| 摘要 |
To suitably electrically interconnect a recording element substrate, on which power supply paths are formed in a high density, and an electric wiring substrate, on which wiring lines for supplying power to these paths are formed, bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween so as to protrude by a predetermined distance t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined distance t2, where t1<t2. By fitting the connecting terminals between respective pairs of the insulating films, each connecting terminal comes in contact with a corresponding bump with a sufficient contact area provided therebetween so as not to give rise to short-circuiting or open-circuiting.
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