| 发明名称 |
Adsorption process for atomic layer deposition |
| 摘要 |
A method for conducting an ALD process to deposit layers on a substrate which includes an electrostatic chuck (ESC) to retain the substrate. Electrode(s) in the chuck assembly are used to induce a voltage on the substrate to promote precursor adsorption on the substrate.
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| 申请公布号 |
US6630201(B2) |
申请公布日期 |
2003.10.07 |
| 申请号 |
US20010999636 |
申请日期 |
2001.10.24 |
| 申请人 |
ANGSTRON SYSTEMS, INC. |
发明人 |
CHIANG TONY P.;LEESER KARL F.;BROWN JEFFREY A.;BABCOKE JASON E. |
| 分类号 |
C23C16/02;C23C16/08;C23C16/18;C23C16/34;C23C16/40;C23C16/44;C23C16/448;C23C16/455;C23C16/458;C23C16/515;H01J37/32;H01L21/285;H01L21/768;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/02 |
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