发明名称 |
Power semiconductor package with strap |
摘要 |
A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.
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申请公布号 |
US6630726(B1) |
申请公布日期 |
2003.10.07 |
申请号 |
US20010008048 |
申请日期 |
2001.11.07 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
CROWLEY SEAN T.;ANDERSON WILLIAM M.;BOLAND BRADLEY D.;BERGMAN EELCO |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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