发明名称 Apparatus and method for separating cull in a package assembly process
摘要 An apparatus and a method for separating a cull from a molded part including a chip mounted on a tape circuit board are provided. The apparatus includes a cull support block for supporting a cull and a cull holder for clamping the cull. The cull holder is disposed above the cull support block. The apparatus further includes a frame support block for mounting a molded part and a frame holder for pressing the molded part against the frame support block to fix the molded part thereon. The frame support block is hinged on a first axis near the cull support block. The frame holder is hinged on a second axis near the cull support block. The apparatus also includes a pressing means configured to move downward against a distal end of the frame holder to cause the frame support block and the frame holder to rotate about the first and second axes, respectively, to separate the cull from the molded part.
申请公布号 US6629351(B2) 申请公布日期 2003.10.07
申请号 US20020225688 申请日期 2002.08.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE DAE-SUNG;JEON BYOUNG-CHEOL
分类号 H01L21/56;(IPC1-7):B23P19/00 主分类号 H01L21/56
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