| 摘要 |
<p>PURPOSE:To enhance the yield of a semiconductor device and produce a more general purpose semiconductor device. CONSTITUTION:A lead is divided into a first lead 6A and a second lead 6B. A sealing body 4 and the first lead 6A constitutes a first sealing body 5 and the second lead 6B is bounded with a second sealing body 8. The second lead 6B is mounted to the first lead 6A removably. Since the length of the first lead 6A is shortened as a result, its strength is enhanced while its deformation is reduced. It is, therefore possible to constitute semiconductor devices under various structures by changing the shape of the second sealing body 8 and the second lead 6B.</p> |
