| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic equipment cooling device and a cooling method, where a semiconductor chip or the like which is high in degree of integration and capable of carrying out the computation and control of data at a high speed can be compactly and efficiently cooled down. SOLUTION: An electronic equipment cooling device is equipped with a heat dissipating fin composed of heat dissipating metal fins which are each provided with a horizontal wall thermally connected to the plate-like heat dissipating member and a vertical main wall and at least a heat pipe thermally connected to the heat dissipating metal fins. |
