发明名称 SURFACE PROCESSING DEVICE AND METHOD
摘要 <p>PURPOSE:To enable the surface processing process to be accelerated by a method wherein the atmosphere in the first and second auxiliary chambers is almost equalized with that in an etching chamber while the surface is being processed. CONSTITUTION:A feeding cassette 58a containing a specific number of objects 57 to be processed is carried to a specific position in a loading chamber 44. Next, the third gate valve 43 is opened for taking out the object 57 from the feeding cassette 58s to the first auxiliary chamber 42. Next, the third gate valve 43 is closed to pressure-reduce the second reserve chamber 45 together with the first auxiliary chamber 42 furthermore opening and closing valves 55, 56 are opened to feed an etching gas so that the atmosphere in both auxiliary chambers 42, 45 may be almost equalized with that in an etching 33 while the etching is being performed. Through these procedures, the exhaust time, the etching gas feeding time, etc., can be saved thereby enabling the etching process to be accelerated.</p>
申请公布号 JPH0661327(A) 申请公布日期 1994.03.04
申请号 JP19920214424 申请日期 1992.08.12
申请人 TOSHIBA CORP 发明人 HAZUKI RIYOUICHI
分类号 C23C14/56;C23C16/44;H01L21/67;H01L21/68;(IPC1-7):H01L21/68 主分类号 C23C14/56
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