SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE USING SAME

摘要

PURPOSE:To obtain a small semiconductor package that has a packaging area reduced by shortening the length of interconnections of a substrate and makes high speed processing possible, and to obtain a semiconductor module which uses this semiconductor package. CONSTITUTION:Inner leads are formed on the surface of the inside from the outer peripheral surface of a semiconductor element 5 via an insulating tape 8. These inner leads are routed around to the vicinity of electrodes 9 arranged in two lines at the center of the semiconductor element 5. The inner leads and the electrodes 9 are connected with each other by fine metal wires, and the semiconductor element 5 is molded with a molding resin 1. Outer leads 4 are formed on one shorter side of a semiconductor package 1A.