| 摘要 |
PURPOSE: A CMP(Chemical Mechanical Polishing) equipment having a polishing head is provided to be capable of uniformly pressing a semiconductor wafer when carrying out a CMP process. CONSTITUTION: CMP equipment is provided with a turn table and a polishing head for holding a wafer and pressing the wafer on the turn table. The polishing head includes an upper plate(310) of the head, a carrier(320) located at the back side of the upper plate of the head, a center clamp(330) located at lower portion of the carrier, the first and second inner tube located between the carrier and the center clamp for being connected through the first and second inner tube pressure pipe, respectively, a porous plate(335) having a plurality of holes(336), located at the lower portion of the center clamp, a membrane(340) located at the lower portion of the porous plate for contacting the wafer, and a retainer ring(350) located at the lower edge portion of the carrier.
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