METHOD FOR COOLING ELECTRONIC DEVICE

摘要

PURPOSE: A method for cooling an electronic device is provided to be capable of effectively releasing the heat generated from the electronic device to the outside by uniformly depositing a metal layer having a good thermal conductivity on the upper portion of a porous silicon layer. CONSTITUTION: An electronic circuit(4) is formed at the front surface of a silicon substrate(3). A porous silicon layer(6) is formed at the rear surface of the silicon substrate by polarization reaction. An electronic device is completed by forming metal layer(2) at the upper portion of the porous silicon layer. At this time, a cooling process is quickly carried out at the electronic device due to the good thermal conductivity of the porous silicon layer and the metal layer.