发明名称 EPOXY MOLD-COATING AGENT WITH LOW VISCOSITY
摘要 PURPOSE: Provided is an epoxy mold-coating agent with low viscosity, which is excellent in weather resistance, endurance, non-yellowing property, gloss property, and formability and is used for coating accessories, ornaments, surfaces of walls, or boards. CONSTITUTION: The epoxy mold-coating agent comprises: 100pts.wt. of a resin component containing 70-85wt% of an epoxy base resin, 10-20wt% of xylene as a non-reactive diluent, 1-5wt% of a plasticizer, 0.1-1wt% of an antifoaming agent, and 1-5wt% of a coagulant; 40-60pts.wt. of a curing component containing 50-70wt% of a modified aliphatic amine as a curing agent, 25-35wt% of nonyl phenol as an accelerator, 5-20wt% of the epoxy resin as a pre-reacting agent; 0.001-0.01pts.wt. of an aggregation controlling component containing 80-95wt% of a modified alicyclic amine, 1-10wt% of the xylene as a non-reactive diluent, and 1-10wt% of methyl phenol as a catalyst. Additionally, the resin component contains 10-20wt% of polypropylene glycol diglycidyl ether as a reactive diluent.
申请公布号 KR20030077896(A) 申请公布日期 2003.10.04
申请号 KR20020016877 申请日期 2002.03.27
申请人 KIM, SANG YANG 发明人 KIM, SANG YANG
分类号 C09D163/00 主分类号 C09D163/00
代理机构 代理人
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