LAMINATED MATERIAL FOR MANUFACTURING PRINTED WIRING BOARD, LAMINATE, COPPER FOIL WITH RESIN, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminated material for manufacturing a printed wiring board which can improve high frequency characteristic of the printed wiring board by improving low transmission loss property in the case of high frequency transmission, with a copper foil constituting a conducting layer of the printed wiring board.

SOLUTION: The laminated material for manufacturing a printed wiring board is constituted by laminating resin layers and copper layers. The resin layer is formed of a thermosetting resin composition which contains a component having an unsaturated double bond and in which permittivity of the hardened material becomes at most 3.5. After a copper foil surface on which a resin layer is to be formed is treated by using zinc or a zinc alloy, coupling agent treatment is performed by using a silane coupling agent containing a vinyl group.

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