发明名称 |
COPPER CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To form a copper plating layer easily and surely at the through hole part of a copper clad laminated board for a flexible printed wiring board. SOLUTION: A base film having a metal oxide film layer and added with 15-70 vol.% of conductive fine metal powder is employed in a plastic film becoming the base of a copper clad laminated board in a flexible printed wiring board. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003283078(A) |
申请公布日期 |
2003.10.03 |
申请号 |
JP20020084263 |
申请日期 |
2002.03.25 |
申请人 |
FUJIKURA LTD |
发明人 |
KONO TSUKASA;KUROSAWA YUKIHIKO;TANABE NOBUO;KOBAYASHI KAZUHARU |
分类号 |
B32B15/08;C08K9/02;C08L101/00;H05K1/03;H05K1/11;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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