发明名称 COPPER CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To form a copper plating layer easily and surely at the through hole part of a copper clad laminated board for a flexible printed wiring board. SOLUTION: A base film having a metal oxide film layer and added with 15-70 vol.% of conductive fine metal powder is employed in a plastic film becoming the base of a copper clad laminated board in a flexible printed wiring board. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283078(A) 申请公布日期 2003.10.03
申请号 JP20020084263 申请日期 2002.03.25
申请人 FUJIKURA LTD 发明人 KONO TSUKASA;KUROSAWA YUKIHIKO;TANABE NOBUO;KOBAYASHI KAZUHARU
分类号 B32B15/08;C08K9/02;C08L101/00;H05K1/03;H05K1/11;H05K3/46;(IPC1-7):H05K1/03 主分类号 B32B15/08
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