发明名称 COMPOUND CURRENT COLLECTOR
摘要 PROBLEM TO BE SOLVED: To provide a compound current collector of resin and a metal in which junctions of lead wires have only to be put on either a front or back face, and which can be made more lightweight than a metallic foil, and moreover, to provide the compound current collector which can respond also to a demand for thinning. SOLUTION: By forming electric conduction treatment layers 12a and 12b on both faces of a resin film 11 with many through-holes 15, and after forming metal-plating layers 13a, 13b and 13c on the electric conduction treatment layers by an electrolysis metal-plating treatment, the compound current collector has a surface electric resistance of 40 mΩ/cm or less, a tensile strength of 0.8 kg/cm, and a front-back resistance of the electric conduction of 100 mΩ/cm or less, and a formula Y1+Y2+Y3≤0.8×(X1+X2+X3)×Y3/X3 is satisfied further. Here, X1 is the thickness of the resin film (μm), X2 is the thickness (μm) of the electric conduction treatment layer, X3 is the thickness (μm) of the metal- plating layer, Y1 is the weight (mg/cm<SP>2</SP>) of the resin film, Y2 is the weight (mg/cm<SP>2</SP>) of the electric conduction treatment layer, and Y3 is the weight (mg/cm<SP>2</SP>) of the metal-plating layer. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282064(A) 申请公布日期 2003.10.03
申请号 JP20020079426 申请日期 2002.03.20
申请人 TOYO KOHAN CO LTD 发明人 OKAMURA TAKAAKI;HIRAKAWA SHINSUKE
分类号 H01M4/66;(IPC1-7):H01M4/66 主分类号 H01M4/66
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