| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device composed of laminated semiconductor chips (semiconductor elements) which can be easily aligned, its manufacturing method, a circuit board, and an electronic apparatus. SOLUTION: A drag 22 on which connection terminals 40 are placed is moved under the semiconductor chip 10, and the drag 22 and the semiconductor chip 10 are aligned with each other so as to make through-holes 14 confront the connection terminals 40 located below (see (a)). A flux 34 is applied on the inner circumferential surfaces of the through-holes 14. By a suction force applied to a first surface 1 side, the connection terminals 40 are energized upward to the semiconductor chip 10. The drag 22 is made to ascend to insert the connection terminals 40 into the through-holes 14 (see (b)). The connection terminals 40 and the semiconductor chip 10 are tentatively fixed together. When the drag 22 is made to descend, the connection terminals 40 are separated from the drag 22 and tentatively fixed to the surface 12 of the semiconductor chip 10. By this setup, the semiconductor device where the connection terminals 40 are tentatively fixed is formed (see (c)). COPYRIGHT: (C)2004,JPO
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