FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, DEVICE OF MANUFACTURING THE SAME, PROTECTION TAPE USED FOR THE SAME METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting film carrier which does not easily generate warping deformation of the film carrier due to the hardening and concentration of a solder resist layer forming resin, and surely protects a wiring pattern with higher accuracy because the so-called solder resist layer is formed by punching a protection tape consisting of a heat resistant protection resin film where a thermal setting bonding agent layer is formed and then bonding this punched piece. SOLUTION: The film carrier tape for mounting electronic component is characterized in that the wiring pattern formed on an insulation film is protected with a resin layer except for the terminal portion and is also protected with a heat resistant protection resin film where the wiring pattern is adhered with a thermosetting bonding agent. This film carrier tape for mounting electronic component may be formed by punching the protection tape consisting of the thermosetting bonding agent layer where the wiring pattern is allocated on the pattern forming surface of the heat resistant protection resin film, and then thermally crimping the punched protection tape piece to the protecting area of the wiring pattern or by temporarily bonding the protection tape which has been previously punched to expose the terminal portion, and thereafter holding such protection tape for the predetermined period within the heating furnace. COPYRIGHT: (C)2004,JPO