发明名称 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a component mounting method, and a component mounting system, comprising a plurality of steps for mounting a component in which the characteristics of a component mounted can be match the preceding and following steps. SOLUTION: The component mounting system 100 comprises a first mounting section 1 for mounting one or a plurality of components 12 on a circuit board 11, and a second mounting section 5 for mounting one more or a plurality of components 15 on the circuit board 11 mounted with the components 12 at the first mounting section 1. Upon finishing operation at the first mounting section 1, the circuit board 11 is imparted with information 13 indicating the characteristics of the component 12 mounted at the first mounting section 1 or of the circuit board 11 including the component 12. The circuit board 11 is carried in the second mounting section 5 where the characteristics information 13 is detected and a component 15 matching the component 12 mounted at the first mounting section 1 is packaged. The component mounting system 100 thereby comprises a board characteristics judging section 2, a characteristics information imparting section 3, a characteristics information detecting section 6, a mounting control section 7, and a component information data base 8. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283199(A) 申请公布日期 2003.10.03
申请号 JP20020078550 申请日期 2002.03.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HATTORI YOSHIYUKI;MORI TETSUYA
分类号 H05K13/04 主分类号 H05K13/04
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