| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method of manufacturing a semiconductor device capable of removing a coated film at the periphery of a substrate with accuracy while forming a uniform coated film. <P>SOLUTION: In forming a coated film on a wafer W, it is held by means of vacuum suction and rotated. In removing the coated film that is formed on the edge of the wafer W, it is mechanically held and rotated in such a manner that the center of the wafer W coincides with the center of rotation. In an alignment mechanism of the wafer W, a rotary base 21 is rotated in the direction of an arrow A so as to rotate the first connecting member 26. Then, the second connecting member 27 that is rotatably connected with the other end of the first connecting member 26 and a holding member 24 are also rotated in the direction of an arrow B. A centripetal force operating by the rotation at this time acts on the holding member 24, and thereby, the holding member 24 moves in the direction of the center of rotation of an arrow C while rotating. The holding member 24 presses the side of the wafer W against the center of rotation. <P>COPYRIGHT: (C)2004,JPO |
