| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device, which reduces warpage and remnant stress of a ceramic substrate, and reduces inclination of an optical semiconductor element and occurrences of cracking in the ceramic substrate. <P>SOLUTION: The device is provided with the optical semiconductor element 12 at least including one of a light-emitting element and a light-receiving element, the ceramic substrate 11 mounting the optical semiconductor element 12, a lid 18 arranged above the ceramic substrate 11 including the optical semiconductor element 12, and a low melting point glass member 19 for welding the lid 18 to the ceramic substrate 11. <P>COPYRIGHT: (C)2004,JPO |
