| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus which can speedily cool a substrate having been heat-treatment in a heat-treatment furnace, always obtain a constant cooling effect, and secure the uniformity of treatment among substrates. SOLUTION: A shutter plate 24 is arranged between a light incident window 12 of a heat-treatment furnace 10 and a lamp 20 of a lamp house 18, held at a standby position in heat treatment, and moved fast from the standby position to an operating position at or immediately before the end of the stop of power supply to the lamp after the heat treatment, so that the shutter plate cuts off the radiation of the remaining heat of the lamp to a wafer W in the heat- treatment furnace. A cooling plate 32 is arranged at the standby position, to cool the shutter plate retracted from the operation position. COPYRIGHT: (C)2004,JPO
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