| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To ensure moisture resistance on a bonding surface while ensuring the reliability of wire connection, in an electronic device in which a first bonding surface and a second bonding surface for aluminum wire bonding are covered with silicon gel. <P>SOLUTION: In a case 10, a first substrate 20 for mounting a power element 21 and a second substrate 30 having a pad 31 are housed, and a pad 22 of the power element 21 as the first bonding surface and the pad 31 of the substrate 30 as the second bonding surface are connected by an aluminum bonding wire 40. These bonding surfaces 22, 31 are covered with the silicon gel 50, and thicknesses (a), (b) of the gel 50 are not less than 100μm and not more than 1 mm. <P>COPYRIGHT: (C)2004,JPO</p> |
