| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor that is capable of coping with bulk mounting through which it can be mounted at a low cost, without taking into consideration of its front facing upward or downward and equipped with a resistor which can be easily formed into a required pattern. <P>SOLUTION: A frame-shaped raised insulating layer 14 is formed in a region surrounding a resistor 13 on an insulating board 12, a surface electrode 17 is formed on a part of the insulating layer 14 so as to set the level of the top surface of a plating layer 21 on the surface electrode 17 equal to or higher than that of the top surface of an overcoat layer 16 on the resistor 13. In this way, even if a chip resistor 11 is mounted on a circuit board 30 as the resistor 13 is kept closer to the circuit board 30, the plating layer 21 of the surface electrode 17 scarcely peels off from a corresponding land 31. Smears or runs liable to occur at printing can be prevented in printing by surrounding a printing region for the resistor 13 with a frame-shaped raised insulating layer 14 in advance. <P>COPYRIGHT: (C)2004,JPO</p> |
