发明名称 COOLING APPARATUS FOR INFORMATION PROCESSING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To make a sink section of an information processing device thin, silent, and highly efficient in the information processing device including a cooling structure using heat transmitting means. such as a heat pipe and a liquid cooling system. <P>SOLUTION: Heat produced in a CPU 1 is transmitted with the aid of a cooling fluid transported with a pump 5 to a sink section 200 after passage through a heat reception header 4 and a flexible tube 7. The sink section 200 comprises a propeller 9, a wall surface 12 in contact with the propeller 9, and a spiral cooling pipe 8 wound spirally around a rotary shaft 9(b) to provide a surface located perpendicularly to the propeller rotary shaft 9(b). The cooling fluid is circulated such that a high temperature cooling fluid is injected from a central portion of the cooling pipe 8 and is drained from an external peripheral portion. Cooling air from the propeller 9 is adapted to flow toward the peripheral portion from the central portion of the cooling pipe 9. Further, the wall surface 12 is adapted to be a heat spreader by thermally connecting the cooling pipe 8 to the wall surface 12. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003283172(A) 申请公布日期 2003.10.03
申请号 JP20020087381 申请日期 2002.03.27
申请人 HITACHI LTD 发明人 SAEKI SUKEYUKI;OIKAWA HIRONORI;TOIZONO TAKESHI
分类号 F28D15/02;G06F1/20;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28D15/02
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