| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a package for housing an optical semiconductor element that can airtightly house the optical semiconductor element by preventing the occurrence of cracks through a plate-shaped light-transmissive member from its main surface to its side face, and at the same time, can make the semiconductor element to normally and stably operate and can efficiently transit optical signals. <P>SOLUTION: In the package for housing optical semiconductor element, the plate-shaped light-transmissive member 4 held by one end of the optical semiconductor element 8 on a placing section 1a side inside a holding member 5 is also held by a projecting section 5b which is continuously formed on the inner peripheral surface of the holding member 5 over the full circumference and is thinner in thickness than the thickness of a frame body 2 in a state that the outer peripheral section of one main surface of the member 4 is brazed to the projecting section 5b through a metallized layer 4a. <P>COPYRIGHT: (C)2004,JPO</p> |
