| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which can be increased in mounting area per unit volume and, consequently, product of which can be improved in mounting density and reduced in size. SOLUTION: This power module is constituted by assembling three planar heat conductive bases 13 having slopes at both ends to have a U-shaped cross section. Each conductive base 13 is fitted with an insulating circuit board 12 fitted with power semiconductor elements 11. COPYRIGHT: (C)2004,JPO |
