发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a drawing process that enables efficient recognition operation by an automatic recognition camera in a succeeding process by suppressing a variance in pitch and linearity between a plurality of bar arrays of a semiconductor chip, which are stuck on an adhesive sheet at arbitrary positions and equal pitches in parallel, when the adhesive sheet is drawn. SOLUTION: A belt-like sheet 101 (e.g. cellophane tape) provided with an adhesive layer made of a transparent material having expansivity lower than that of the base material 2 of the adhesive sheet 1 is stuck on the adhesive sheet 1 and supplied to a drawing apparatus 12 to expand intervals of semiconductor chips 4 which are adjacently arranged in bar shapes. Here, the belt-like sheet 101 is stuck only nearby both sides of the bar-shaped array of semiconductor chips 4 obtained by dividing one semiconductor bar 5 at angles vertical to the length direction of the bar-shaped array. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282482(A) 申请公布日期 2003.10.03
申请号 JP20020078312 申请日期 2002.03.20
申请人 NEC KANSAI LTD 发明人 WATANABE HIDEAKI
分类号 H01L21/301;(IPC1-7):H01L21/301 主分类号 H01L21/301
代理机构 代理人
主权项
地址