| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device mounted with a semiconductor chip which can be easily and accurately positioned and hardly suffers from a characteristic change and cracking even if it is repeatedly subjected to a thermal cycle for a long term. SOLUTION: The semiconductor device 101 is equipped with a mounting stem 20 where semiconductor elements 4 and 40 are mounted. The mounting stem 20 is composed of a first metal 21 having a thermal expansion coefficient approximate to those of the semiconductor chips 4 and 40, and second metals 22 and 23 which sandwich the first metal 21 and are easily deformed. COPYRIGHT: (C)2004,JPO |
