发明名称 INSULATION RESIN COMPOSITION, INSULATOR WITH COPPER FOIL, AND LAMINATED PLATE WITH COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable and heat resisting insulation resin composition which is machined well by a small diameter laser beam, corresponding minute machining, to provide a sheet with the insulation resin composition, and to provide an insulator with a copper leaf. SOLUTION: The insulation resin compound comprises, electrically insulating whiskers, an inorganic filling material such as metal hydroxide, a coloring component which has an absorbing band around a specified wave length, a hardening, and a hardening agent in which other components are mixed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003281940(A) 申请公布日期 2003.10.03
申请号 JP20020083389 申请日期 2002.03.25
申请人 HITACHI CHEM CO LTD 发明人 TANABE TAKAHIRO;TOSAKA YUJI
分类号 B32B15/08;C08K3/22;C08K7/02;C08L63/00;C08L101/00;C09J7/00;C09J7/02;C09J11/00;C09J163/00;C09J201/00;H01B3/00;H01B3/30;H01B3/40;H05K3/46;(IPC1-7):H01B3/30 主分类号 B32B15/08
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