| 摘要 |
PROBLEM TO BE SOLVED: To provide a means capable of easily inserting dummy metals as many as possible and preventing the deterioration of the performance of a already existing wiring metal signal due to the insertion of the dummy metals. SOLUTION: In a semiconductor integrated circuit, the dummy metal 1 is not arranged at a position whereat a distance between the dummy metal 1 and a wiring metal 4 becomes shorter than a preset limited distance in arrangement. The limited distance in arrangement is preferably changed by the width of the dummy metal 1 and the neighboring wiring metal 4. According to this method, the dummy metals 1 can be easily inserted into a wiring metal layout as many as possible, and the deterioration of the performance of the already existing wiring metal signal due to the insertion of the dummy metals 1 can effectively be prevented. COPYRIGHT: (C)2004,JPO
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