| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing equipment and a polishing method wherein the difference between polishing speeds in the vicinity of the edge and the center of a wafer is reduced, and a polishing speed in a plane is made constant in the case that a part is formed in which an air layer is formed between an abrasive cloth and a platen when the abrasive cloth is stuck on the platen, so that the wafer can be polished uniformly. <P>SOLUTION: Holes 12 are formed into almost concentric circulars in the platen 10. The holes 12 are distributed in such a manner that the number of the holes near a peripheral edge is greater as compared with that in the vicinity of the center of the wafer 11 when the wafer 11 is polished. Pipings connected with holes (e.g. 12a) which are positioned at equivalent positions on the wafer 11 in the case of polishing are connected with the same vacuum pump and the same pressurized air supply source. Individual discharge by each of the vacuum pumps and individual air supply by each of the pressurized air supply sources are enabled by opening and closing a valve. <P>COPYRIGHT: (C)2004,JPO |
