发明名称 SEMICONDUCTOR DEVICE FOR FINGERPRINT RECOGNITION AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To improve operability upon contacting a finger with a fingerprint detecting area, in a semiconductor device for effecting the fingerprint recognition by tracing a finger on the fingerprint recognition area of a semiconductor element for fingerprint recognition and the manufacturing method thereof. <P>SOLUTION: In the semiconductor device for fingerprint recognition having the semiconductor element 11 provided with the fingerprint recognition area 15 for effecting the fingerprint recognition, an external connecting terminal 13, and a wiring board 12 for electrically connecting the semiconductor element 11 to the external connecting terminal 13, the semiconductor element 11 is connected to the wiring board 12 through a flip chip. Further, an opening part 16 is formed on the wiring board 12 while the opening part 16 is constituted so as to be opposed to the fingerprint recognition area 15. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003282609(A) 申请公布日期 2003.10.03
申请号 JP20020089533 申请日期 2002.03.27
申请人 FUJITSU LTD 发明人 SAKOTA EIJI
分类号 H01L23/28;G06T1/00;H01L21/56;H01L23/12;(IPC1-7):H01L21/56 主分类号 H01L23/28
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