| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a film substrate for a circuit which can realize a film substrate for a circuit as a flexible base substance of stable quality, at a low cost. SOLUTION: On one flat surface or both flat surfaces of a flexible resin film like a liquid crystal polymer film 10 a sputtered layer excellent in adhesion like a comparatively thin copper sputtered layer 11 is closely formed by sputtering. In a vacuum, continuously, a copper deposition layer 12 is closely formed on the sputtered layer 11 by deposition. A sum of thickness of the sputtered layer 11 and the copper deposition layer 12 is set in a range of 0.5-12μm, thereby enabling excellent film formation which is excellent in adhesion to the flexible resin film and has no pin holes. COPYRIGHT: (C)2004,JPO
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