发明名称 DISCHARGE PLASMA PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a discharge plasma processing method forming a high- quality thin film on the surface of a workpiece at a high speed without exposing the whole body of the workpiece to a high temperature. <P>SOLUTION: This plasma processing method impresses an electric field between a pair of opposed electrodes, whose one electrode opposite surface, at least, is covered with a solid dielectric, and jets a glow discharge plasma generated by introducing processing gas between the opposed electrodes, to the workpiece body disposed outside the plasma generation space. This discharge plasma processing method is characterized in locally heating the plasma jetting part and its surroundings of the workpiece body. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282299(A) 申请公布日期 2003.10.03
申请号 JP20020081127 申请日期 2002.03.22
申请人 SEKISUI CHEM CO LTD 发明人 NAKAJIMA SETSUO;ITO TAKUMI
分类号 H05H1/46;C23C16/50;H01L21/31;H01L21/316 主分类号 H05H1/46
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