发明名称 METHOD AND DEVICE FOR ASSEMBLING BOARD
摘要 PROBLEM TO BE SOLVED: To solve a problem that when a board is held using an adhesive sheet, an air layer is formed between the board and the sheet and since the air layer expands when the ambient pressure is reduced under that state, adhesion lowers to possibly cause falling of the board and that the pasted adhesive sheet must be stripped by hand. SOLUTION: An adhesion holding mechanism produced by applying an adhesive sheet 42b to an iron plate 41b is secured at least to a press plate 7. Furthermore, a plurality of suction chucking holes 7d are made to extend from the press plate 7 to the surface of the adhesion holding mechanism. An upper board 1b is then suction chucked while holding adhesion and pressure bonded to a lower board 1a. Thereafter, the adhesive sheet 42b is stripped from the surface of the upper board 1b using a stripping mechanism comprising a push shaft 48b. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283185(A) 申请公布日期 2003.10.03
申请号 JP20020087351 申请日期 2002.03.27
申请人 HITACHI INDUSTRIES CO LTD;SHARP CORP 发明人 HACHIMAN SATOSHI;YAMAMOTO TATSUHARU
分类号 G02F1/13;G02F1/1333;G09F9/00;H05K13/00;(IPC1-7):H05K13/00;G02F1/133 主分类号 G02F1/13
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