| 摘要 |
PROBLEM TO BE SOLVED: To enhance reliability without incurring cost increase. SOLUTION: After the leads 11 of a glass substrate 10 and the leads 21 of an FPC (flexible printed circuit board) 20 are joined via an ACF (anisotropic conductive film) 30, the ACF is pushed out on the exposed parts of the leads 11 of the glass substrate 10 and of the leads 21 of the FPC 20 while the leads 11 of the glass substrate 10 and the leads 21 of the FPC 20 are thermocompressed by a compression tool 50, and the ACF 30 is naturally dried. Namely, the coating of the exposed parts of the leads 11 of the glass substrate 10 and the leads 21 of the FPC 20 with the ACF 30 is simultaneously carried out with thermocompression bonding. COPYRIGHT: (C)2004,JPO
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