SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the mounting reliability of a multi-pin QFN (Quad Flat Non-leaded package) and to reduce its manufacturing cost.

SOLUTION: A die pad 4 mounted with a semiconductor chip 2 is arranged at the center of a sealing body 3 composing a package of the QFN1. A plurality of leads 5 are arranged so as to surround the die pad 4. One ends 5a of the leads 5 are each electrically connected to a bonding pad on the main surface of a semiconductor substrate 2 through the intermediary of an Au wire 6, and the other ends 5c of the leads 5 each terminate at the side face of the sealing body 3. External connection terminals 5d formed by partially bending the leads 5 by a press protrude outward from the rear surface of the sealing body 3, and a solder layer 9 is formed on each surface of the terminal 5d.

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