发明名称 TREATMENT SYSTEM OF SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a treatment system of boards for flexible printed wiring boards by a roll-to-roll method by which a development time, etching time and peeling time can be easily adjusted. SOLUTION: With respect to a horizontal transfer and the treatment system of a spray by which the boards for flexible printed wiring boards are consecutively treated with chemicals by the roll-to-roll method, a shielding plate 6 which can be moved by extension and contraction is provided between upper and lower spray nozzles 4 and transfer driving parts 1 in a chemical bath. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283101(A) 申请公布日期 2003.10.03
申请号 JP20020083014 申请日期 2002.03.25
申请人 SUMITOMO BAKELITE CO LTD 发明人 MIYANO AKIKO
分类号 C23F1/08;H05K3/00;H05K3/06;(IPC1-7):H05K3/00 主分类号 C23F1/08
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