发明名称 METHOD AND DEVICE FOR SOLDER BALL MOUNTING INSPECTION
摘要 PROBLEM TO BE SOLVED: To provide a solder ball mounting inspection device which can eliminate an influence in irregular reflection and disturbance light in a flux and improve inspection accuracy. SOLUTION: The device is constituted of an imaging means 1 for imaging a solder ball with a flux mounted on a pad electrode of a semiconductor device; an image processing means 2 for obtaining luminance data for each picture element by dividing image data into a plurality of picture elements; a non-defective luminance data storage means 3; a luminance difference calculation means 4 for obtaining luminance data for each picture element from the image processing means 2 and obtaining luminance data for each picture element from the non-defective luminance data storage means 3, and obtaining luminance difference of between both of them for each picture element; a filter function preparation registration means 5 for preparing and registering a filter function for each picture element based on luminance data for each picture element of non-defective; and a defective or non-defective determination means 6 by multiplying luminance difference for each picture element obtained in the means 4 by a filter function of a corresponding picture element obtained from the means 5 and determining defective or non-defective of the mounting state of a solder ball with a flux based on its output. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282618(A) 申请公布日期 2003.10.03
申请号 JP20020086483 申请日期 2002.03.26
申请人 UENO SEIKI KK 发明人 FUJINAMI ATSUSHI
分类号 G01B11/24;H01L21/60;(IPC1-7):H01L21/60 主分类号 G01B11/24
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