| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor which is capable of surely preventing the silver component contained in its electrode from being sulfurated or migrating and reducing the cost of its electrode material. <P>SOLUTION: A metal oxide film 21, covering a resistor 13 and the surface electrode 14, is previously formed on an insulating board 12, and the metal oxide film 21 is confronted with a boundary A between an overcoat layer 16 and plating layers 19 and 20. By this setup, gas or moisture, which infiltrates to the boundary A that is not hermetically bonded, is blocked by the metal oxide layer 21 so as not to reach the surface electrode 14, and the surface electrode 14 can be surely prevented from being sulfurated or migrating, even if it is a silver electrode containing no Pd or Pt. <P>COPYRIGHT: (C)2004,JPO</p> |
