| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element that can prevent a housed semiconductor element from malfunctioning due to the high-frequency signal component of a terminating signal entering into a terminating electrode of the element. SOLUTION: This package is provided 1 with a substrate having a placing section 1a for placing the semiconductor element 5 and a circuit board 6 on its upper main surface, the circuit board 6 placed on the section 1a, and a frame body 2 bonded to the outer peripheral section of the upper main surface of the substrate 1 so as to surround the section 1a. On the upper surface of the circuit board 6, a line conductor 6b and a grounding conductor 6c surrounding the conductor 6b are formed. The line conductor 6b is connected to the semiconductor element 5 on one end side and to the grounding conductor 6c through high-resistance sections 8 on the other end side. The sections 8 are nearly axially symmetrically disposed on both sides of the line conductor 6b from one end at distances of <1/2 wavelength of high-frequency signals of used frequencies. In addition, the distance P between the end face of the other end of the line conductor 6b and the grounding conductor 6c is adjusted to 0.5-3 times as large as the distance between the conductors 6b and 6c. COPYRIGHT: (C)2004,JPO |
