FAILURE SEMICONDUCTOR ANALYZING TOOL AND SYSTEM THEREOF FAILURE SEMICONDUCTOR ANALYZING METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To accurately grasp a failure position on a semiconductor device to be analyzed and a cause thereof in a short time. SOLUTION: A failure semiconductor analyzing tool or a method using it include at least one or more of wiring design layers, and a user layer for incorporating and displaying an output of a failure semiconductor inspection device or a failure semiconductor analyzing device as data format information. COPYRIGHT: (C)2004,JPO