| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor which is capable of dissipating heat generated from its resistor to the outside (into the air) more efficiently, and to provide its manufacturing method. <P>SOLUTION: The chip resistor is equipped with an insulating board 11, the resistor 15 formed on the surface of the insulating board 11, a pair of electrodes 13 and 13 connected to the resistor 15, and a first protective film 17a and a second protective film 17b covering the resistor 15, and a metal film 16 is interposed between the protective films 17a and 17b. The metal film 16 serves as a heat sink, to expand the effective heat radiation area of the chip resistor, so that the chip resistor small in size and superior in performance can be realized. <P>COPYRIGHT: (C)2004,JPO</p> |
