发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To solve the problem that high-frequency signals can not be surely transmitted in a conventional wiring board because the high-frequency signals are much reflected when they propagate through a wiring conductor. <P>SOLUTION: A new wiring board is composed of an insulating board 1 formed of, at least, one of an aluminum oxide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body; and a wiring conductor 2 which transmits high-frequency signals and is formed on the insulating board 1. Irregularities of the surface of the wiring conductor 2 are each set at 50μm or below. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003282784(A) 申请公布日期 2003.10.03
申请号 JP20020079066 申请日期 2002.03.20
申请人 KYOCERA CORP 发明人 OTOMARU HIDEKAZU
分类号 H05K1/02;H01L23/12;(IPC1-7):H01L23/12 主分类号 H05K1/02
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