| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing an optical device that can effectively prevent junction breakage caused by thermal stresses or external mechanical shocks, in a package for housing a semiconductor element. <P>SOLUTION: The package for housing an optical device is composed of an insulating substrate having a recess for mounting the optical device and a planar cap constituted of a frame body which is bonded to the upper surface of the insulating substrate in a sealed state through a sealing ring composed of an iron-based alloy and having an opening for transmitting light and a light- transmissive window body set up in the opening. The frame body is formed of the same alloy as that used for forming the sealing ring and the window body is formed of a glass material having a softening point of >300°C. In addition, the difference in coefficient of thermal expansion between the alloy and the glass material in the temperature range of 20-300°C is controlled to 0.4-1.0×10<SP>-6</SP>/°C. The frame body and the window body are directly joined to each other by shrinkage fit by contracting the bodies by cooling after the bodies are heated beyond their softening points. <P>COPYRIGHT: (C)2004,JPO</p> |
