| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that electrical connection of conductive material penetrating an insulating substrate and a conducting layer connected with the conductive material is deteriorated in a comparatively short time, when the insulating substrate is exposed to a high temperature. SOLUTION: In this wiring board, a penetrating hole 11a wherein diameters of apertures on both ends are different from each other is bored in the insulating substrate 11, conducting layers 12, 13 overlapping with the penetrating hole 11a are formed on both surfaces of the substrate 11, and the conducting layer 12 and the penetrating hole 11a are filled with conductor 14, thereby electrically connecting the conducting layers 12, 13 on both surfaces of the substrate 11. Between the insulating substrate 11 on the side of a small diameter aperture end 11e and the conducting layer 13, a sputtered film or a deposition film is laminated or a nonelectrolytic plating film is laminated on the sputtered film or the deposition film, thereby forming a ground conducting layer 12. COPYRIGHT: (C)2004,JPO
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