| 摘要 |
PROBLEM TO BE SOLVED: To provide a PTC device which requires no pretreatment and no post-treatment so as to solve the problem of an electrode and a lead being bonded together with solder in a current surface-mounting PTC device, and that the pretreatment and post-treatment which are required in a process limits a processing rate. SOLUTION: Metal components 1 and 1' each functioning as both the jointing function and an electrode function are pasted on the front and rear of a conductive composition 2, so that the parts 3 of the metal components 1 and 1' displaying the jointing function are located on the same surface of the device. COPYRIGHT: (C)2004,JPO
|
